
Brand : Springer, Binding : hardcover, Edition : 1st ed. 2019, Label : The Proceedings of the International Conference on Sensing and Imaging : Chengdu University of Information Technology, Chengdu, Sichuan, China, on June ... in Electrical Engineering, 506, Band 506), medium : hardcover, numberOfPages : 442, publicationDate : 2018-09-19, releaseDate : 2018-09-19, languages : english, ISBN : 3319916580